Diamonds

Advanced Laser MicroJet (LMJ) systems with 3 or 5 axes are perfectly suited for cutting rough diamonds in the diamond industry.

The LMJ technology is a hybrid method combining a laser with a hair-thin water jet that precisely guides the laser beam by means of total internal reflection at the water/ air interface. The cylindrical beam results in precise parallel kerfs and tight kerf widths in high valuable goods like gem diamonds leading to significant less waste material. Customers therefore benefit from marginal weight loss and higher yields.

The water jet cools the cut zone of the stone resulting in very smooth side wall surfaces Compared with conventional laser methods, diamond manufacturers report that the Laser MicroJet with its inherent water cooling capability helps to reduce the damage rate in diamonds drastically, especially in tension goods.

The liquid-jet LMJ technology doesn’t require any focusing or distance control and therefore helps to avoid operator’s mistakes. With the LMJ the laser gets focused from the nozzle and is then guided by the water jet. The focusing point always remains the same, eliminating the need for the time-consuming “blackening”-procedure and enabling,high production rates.

LMJ is also very suitable for processing CVD and HPHT diamonds, especially for slicing thin and parallel to any crystalline orientation (±0.1°) of any crystals or simply for coring applications of CVD material.

Advanced Laser MicroJet (LMJ) systems with 3 or 5 axes are perfectly suited for cutting rough diamonds in the diamond industry.

The LMJ technology is a hybrid method combining a laser with a hair-thin water jet that precisely guides the laser beam by means of total internal reflection at the water/ air interface.

The cylindrical beam results in precise parallel kerfs and tight kerf widths in high valuable goods like gem diamonds leading to significant less waste material. Customers therefore benefit from marginal weight loss and higher yields.

The water jet cools the cut zone of the stone resulting in very smooth side wall surfaces Compared with conventional laser methods, diamond manufacturers report that the Laser MicroJet with its inherent water cooling capability helps to reduce the damage rate in diamonds drastically, especially in tension goods.

The liquid-jet LMJ technology doesn’t require any focusing or distance control and therefore helps to avoid operator’s mistakes. With the LMJ the laser gets focused from the nozzle and is then guided by the water jet. The focusing point always remains the same, eliminating the need for the time-consuming “blackening”-procedure and enabling,high production rates.

LMJ is also very suitable for processing CVD and HPHT diamonds, especially for slicing thin and parallel to any crystalline orientation (±0.1°) of any crystals or simply for coring applications of CVD material.

Performance Capabilities

Drilling of cooling holes in super alloys:

  • Parallel kerfs of 40 to 65 micron, depending on nozzle size

  • Significant lower weight loss compared to conventional laser

  • Very smooth side walls with extremely thin black layer that is easily cleaned off

  • Up to 3 times faster processing compared to conventional lasers
  • Slicing of thin parallel slices (7×7 mm) in only 7 min.

Main Applications

1. Cutting and pie cutting of rough diamonds

2. Round bruiting and fancy bruiting of rough diamonds

3. Blocking/ faceting of diamonds

4. Drilling of straight holes in diamonds

Are you interested in a demo or feasibility test?